LIAN LI Odyssey X Silver Aluminum Full-Tower Case


SKU: MC-CAS-LIA-0007 Category: Brand:

Premium sandblasted anodized aluminum full-tower case with three modes, dual-side folding glass, and support for EEB/E-ATX motherboards.

Shipping & Delivery

  • Pick up from the Megacomputer Store

  To pick up today

Free

  • Express delivery

Applicable to selected areas in Karachi only

1-2 Days

  • TCS Courier delivery

Our courier partner will deliver to your specified address

Delays may occur due to situations out of our control

3-4 Days

 85,000

Description

The LIAN LI Odyssey X Silver Aluminum Full-Tower Case is a premium chassis crafted from sandblasted anodized aluminum, offering a sleek and durable finish. It features a versatile three-mode design: Dynamic, Dynamic-R (Rotate), and Performance, allowing you to customize your setup for optimal airflow or aesthetics. The dual-side folding tempered glass panels provide a clear view of your components while maintaining a clean, modern look.

Designed for high-end builds, this case supports up to EEB/E-ATX motherboards and includes 8 expansion slots for multi-GPU configurations. The open airflow design ensures efficient cooling, making it ideal for demanding systems. Available with nationwide delivery across Pakistan, including Karachi, Lahore, and Islamabad, with cash-on-delivery options.

  • Sandblasted anodized aluminum construction for a premium finish
  • Three configurable modes: Dynamic, Dynamic-R (Rotate), and Performance
  • Dual-side folding tempered glass panels for easy access and display
  • Supports EEB/E-ATX motherboards and 8 expansion slots
  • Open airflow design optimized for high-performance cooling

Specification

Overview

BrandLIAN LI
ModelOdyssey X
ColorSilver
TypeFull-Tower Case
MaterialSandblasted anodized aluminum
Motherboard SupportEEB/E-ATX
Expansion Slots8
PanelTempered glass

Customer Reviews

Reviews

There are no reviews yet.

Be the first to review “LIAN LI Odyssey X Silver Aluminum Full-Tower Case”

Your email address will not be published. Required fields are marked *